Product Lines

C8

HV switch, variable on-time, push-pull, MOSFET  

● HV push-pull switch in halfbridge configuration  ● Two switching paths for fast rise and fall time ● Safe operation due to passive switching path locking ● No cross-over current ● Ideal for precise HV square wave pulses into capacitive load ● No working resistor required ● No necessity for large HV input energy storage capacitors
CAUTION:  Fast push-pull switches (half bridges) are very sensitive for reverse currents from inductive load or from increased wiring inductance. Reverse currents may turn-on the intrinsic (parasitic) MOSFET diodes in an undefined way. This can lead to a short circuit within the bridge switching paths with the further result of a catastrophic failure. Please always make sure that no current swings back into the output of switch. This should be verified by oscilloscope measurements at max. 10% of the actual operating voltage. Please connect always sufficient buffer capacitors (preferably ceramic types) directly to the HV inputs and use sufficient series damping resistors in case of long output wiring. Inductive load on MOSFET switches requires always a fast free-wheeling diode network (serial blocking diode + parallel free-wheeling diode). This protective diode network can be installed externally by means of single diodes of the series BEHLKE FDA. It can also be integrated into the switching module as option I-FWDN. Please read the general instructions carefully.

Technical Note:  BEHLKE push-pull switches have extreme rise and fall times. If your application does not require the full switching speed we suggest you the use of the speed limiting option S-TT (rise & fall times slower by approx. 50%) in combination with the input low pass filter option LP. These options help to minimize the high frequency difficulties typical for fast high voltage pulse circuits  (e.g. self oscillating or self re-triggering) and simplify the EMC design in general. 

Product Code: The model number contains coded information about voltage, current and turn-on behavior.  The first digits stand for the voltage in kV, the last digit before the dash indicates the  turn-on behavior (0 = fixed on-time, 1 = variable on-time). The digits after the dash indicate the current  in Amperes x10. Special features are coded by the letters after a second dash. Example HTS 31-03-HB-C:  HTS = HV Transistor Switch, 3 = 3 kV,  1 = variable on-time, 03 = 30 Ampere, HB = Half Bridge, C = Compact Series.
 
Compact Series. Low self inductance & very short transition times. Good transient immunity. Please scroll down for the options.
Switch Model
[sorted by voltage]

Description / Comment
● Preferred stock type  ○ Limited stock  X Not for new development

Voltage
[kV]

Pk. Current
[A]

On-Resist.
[Ω]

On-Time
[ns]

 Dimensions
L x W x H
[mm3]		 Drawing
(PDF)
HTS 11-07-HB-C ● Designed for PCB assembly. Other housings are optionally available. 2 x 1.2 2 x 70 2 x 1.2 50…∞ 79 x 38 x 17 PDF
HTS 21-07-HB-C ● Designed for PCB assembly. Other housings are optionally available. 2 x 2.4 2 x 70 2 x 2.4 50…∞ 125 x 38 x 17 request
HTS 31-03-HB-C ● Designed for PCB assembly. Other housings are optionally available. 2 x 3 2 x 30 2 x 5 50…∞ 79 x 38 x 17 PDF
HTS 31-13-HB-B-C ●  Designed for PCB assembly. Other housings are optionally available. Trench FET.    2 x 3.9 2 x 130 2 x 0.5 150…∞ 79 x 38 x 17 PDF
HTS 41-02-HB-LC-C ● Designed for PCB assembly. Other housings are optionally available. Low natural capacitance. 2 x 4.8 2 x 25 2 x 7 50…∞ 79 x 38 x 17 PDF
HTS 61-01-HB-C ● Designed for PCB assembly. Other housings are optionally available. 2 x 6 2 x 15 2 x 22 50…∞ 79 x 38 x 17 PDF
HTS 61-03-HB-C ● Designed for PCB assembly. Other housings are optionally available. 2 x 6 2 x 30 2 x 10 70…∞ 125 x 38 x 17 request
HTS 71-13-HB-B-C ● Designed for PCB assembly. Other housings are optionally available. Trench FET.   2 x 7.8 2 x 130 2 x 1 180…∞ 125 x 38 x 17 request
HTS 91-01-HB-C ● Designed for PCB assembly. Other housings are optionally available. 2 x 9 2 x 12 2 x 42 50…∞ 79 x 38 x 17 PDF
HTS 91-02-HB-LC-C ● Designed for PCB assembly. Other housings are optionally available. Low natural capacitance. 2 x 9.6 2 x 25 2 x 15 70…∞ 125 x 38 x 17 request
HTS 111-13-HB-B-C ●  Designed for PCB assembly. Other housings are optionally available. Trench FET.   2 x 11.7 2 x 130 2 x 1.5 220…∞ 158 x 38 x 17 request
HTS 121-01-HB-C ● Designed for PCB assembly. Other housings are optionally available. 2 x 12 2 x 15 2 x 44 70…∞ 125 x 38 x 17 request
HTS 181-01-HB-C ● Designed for PCB assembly. Other housings are optionally available. 2 x 18 2 x 12 2 x 84 70…∞ 140 x 38 x 20 request
 
Standard Series. Preferably for higher switching frequency at low capacitive load. Please scroll down for the options.
Switch Model
[sorted by voltage]

Description / Comment
● Preferred stock type  ○ Limited stock  X Not for new development

Voltage
[kV]

Pk.  Current
[A]

On-Resist.
[Ω]

On-Time
[ns]

  Dimensions
L x W x H
[mm3]		 Drawing
(PDF)
HTS 21-03-GSM ●  HV terminals at front. Good transient immunity. Not recommended for f >200 kHz. 2 x 2 2 x 30 2 x 3.4 80…∞ 89 x 64 x 27 request
HTS 21-06-GSM ●  HV terminals at front. Good transient immunity. Not recommended for f >200 kHz. 2 x 2 2 x 60 2 x 1.7 80…∞ 89 x 64 x 27 request
HTS 31-01-GSM ●  HV terminals at front. Good transient immunity. Not recommended for f >200 kHz. 2 x 3 2 x 15 2 x 16 80…∞ 89 x 64 x 27 request
HTS 31-03-GSM ●  HV terminals at front. Good transient immunity. Not recommended for f >200 kHz. 2 x 3 2 x 30 2 x 8 80…∞ 89 x 64 x 27 PDF
HTS 41-03-GSM ●  HV screw connectors at bottom side (for PCB attachment). Pigtails optionally available. 2 x 4 2 x 30 2 x 7.2 60…∞ 112 x 64 x 27 PDF
HTS 41-06-GSM ● HV screw connectors at bottom side (for PCB attachment). Pigtails optionally available. 2 x 4 2 x 60 2 x 3.6 60…∞ 112 x 64 x 27 PDF
HTS 61-01-GSM ● HV screw connectors at bottom side (for PCB attachment). Pigtails optionally available. 2 x 6 2 x 15 2 x 32 60…∞ 112 x 64 x 27 PDF
HTS 61-03-GSM ● HV screw connectors at bottom side (for PCB attachment). Pigtails optionally available. 2 x 6 2 x 30 2 x 16 60…∞ 112 x 64 x 27 PDF
HTS 81-03-GSM ● HV screw connectors at bottom side (for PCB attachment). Pigtails optionally available. 2 x 8 2 x 30 2 x 16 150…∞ 163 x 64 x 27 request
HTS 81-06-GSM ● HV screw connectors at bottom side (for PCB attachment). Pigtails optionally available. 2 x 8 2 x 60 2 x 8 150…∞ 163 x 64 x 27 request
HTS 111-03-GSM ● HV screw connectors at bottom side (for PCB attachment). Pigtails optionally available. 2 x 11 2 x 30 2 x 20.4 150…∞ 200 x 70 x 28 request
HTS 111-06-GSM ● HV screw connectors at bottom side (for PCB attachment). Pigtails optionally available. 2 x 11 2 x 60 2 x 10.2 150…∞ 200 x 70 x 28 PDF
HTS 151-01-GSM ● HV screw connectors at bottom side (for PCB attachment). Pigtails optionally available. 2 x 15 2 x 15 2 x 72 150…∞ 163 x 64 x 27 request
HTS 151-03-GSM ● HV screw connectors at bottom side (for PCB attachment). Pigtails optionally available. 2 x 15 2 x 30 2 x 36 150…∞ 163 x 64 x 27 request
HTS 161-03-GSM ● HV screw connectors at bottom side (for PCB attachment). Pigtails optionally available. 2 x 16 2 x 30 2 x 32 150…∞ 263 x 70 x 35 request
HTS 161-06-GSM ● HV screw connectors at bottom side (for PCB attachment). Pigtails optionally available. 2 x 16 2 x 60 2 x 16 150…∞ 263 x 70 x 35 request
HTS 201-01-GSM ● HV screw connectors at bottom side (for PCB attachment). Pigtails optionally available. 2 x 20 2 x 15 2 x 96 150…∞ 200 x 70 x 28 request
HTS 201-03-GSM ● HV screw connectors at bottom side (for PCB attachment). Pigtails optionally available. 2 x 20 2 x 30 2 x 48 150…∞ 200 x 70 x 28 request
HTS 301-01-GSM ● HV screw connectors at bottom side (for PCB attachment). Pigtails optionally available. 2 x 30 2 x 15 2 x 144 150…∞ 263 x 70 x 35 request
HTS 301-03-GSM ● HV screw connectors at bottom side (for PCB attachment). Pigtails optionally available. 2 x 30 2 x 30 2 x 72 150…∞ 263 x 70 x 35 PDF
HTS 651-01-GSM X OBSOLETE. Replaced by new model HTS 651-10-GSM. Please refer to the next table. 2 x 65 2 x 15 2 x 288 250…∞ 312 x 200 x 70 request
HTS 651-03-GSM X OBSOLETE. Replaced by new model HTS 651-10-GSM. Please refer to the next table. 2 x 65 2 x 30 2 x 144 250…∞ 312 x 200 x 70 request
 
Power Series, Classical Silicon FET. Robust and transient proof due to LC2 driver technology. For high capacitive, resistive & inductive load.
Please scroll down for the options.
Switch Model
[sorted by voltage]

Description / Comment
● Preferred stock type  ○ Limited stock  X Not for new development

Voltage
[kV]

Pk.  Current
[A]

On-Resist.
[Ω]

On-Time
[ns]

 Dimensions
L x W x H
[mm3]		 Drawing
(PDF)
HTS 81-10-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 8 2 x 100 2 x 3 150…∞ 150 x 100 x 58 request
HTS 81-20-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 8 2 x 200 2 x 1.5 150…∞ 150 x 150 x 58 request
HTS 121-10-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 12 2 x 100 2 x 5 180…∞ 200 x 100 x 68 PDF
HTS 121-20-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 12 2 x 200 2 x 2.5 180…∞ 200 x 150 x 68 PDF
HTS 151-10-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 15 2 x 100 2 x 6 180…∞ 200 x 100 x 68 request
HTS 151-20-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 15 2 x 200 2 x 3 230…∞ 200 x 150 x 68 request
HTS 201-10-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 20 2 x 100 2 x 8 180…∞ 225 x 100 x 68 request
HTS 201-20-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 20 2 x 200 2 x 4 230…∞ 225 x 150 x 68 request
HTS 241-10-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 24 2 x 100 2 x 12 200…∞ 250 x 100 x 68 request
HTS 241-20-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 24 2 x 200 2 x 6 250…∞ 250 x 150 x 68 PDF
HTS 301-10-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 30 2 x 100 2 x 14 200…∞ 300 x 100 x 68 request
HTS 301-20-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 30 2 x 200 2 x 7 250…∞ 300 x 150 x 68 request
HTS 401-10-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 40 2 x 100 2 x 18 250…∞ 372 x 100 x 70 request
HTS 401-20-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 40 2 x 200 2 x 9 250…∞ 372 x 150 x 70 request
HTS 501-10-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 50 2 x 100 2 x 22 250…∞ 432 x 100 x 70 PDF
HTS 501-20-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 50 2 x 200 2 x 11 250…∞ 432 x 150 x 70 request
HTS 651-10-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 65 2 x 100 2 x 28 300…∞ 372 x 300 x 70 request
HTS 651-20-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 65 2 x 200 2 x 14 300…∞ 372 x 350 x 70 request
HTS 701-10-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 70 2 x 100 2 x 30 300…∞ 375 x 300 x 70 PDF
HTS 701-20-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 70 2 x 200 2 x 15 300…∞ 375 x 350 x 70 request
HTS 901-10-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 90 2 x 100 2 x 32 300...∞ 432 x 300 x 70 request
HTS 901-20-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 90 2 x 200 2 x 16 300...∞ 432 x 350 x 70 request
HTS 1201-10-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 120 2 x 100 2 x 42 300...∞ 512 x 350 x 70 request
HTS 1201-20-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 120 2 x 200 2 x 21 300...∞ 512 x 350 x 70 request
HTS 1401-10-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 140 2 x 100 2 x 52 300…∞ 672 x 350 x 90 request
HTS 1401-20-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 140 2 x 200 2 x 26 300…∞ 672 x 350 x 90 request
 
Power Series, Silicon Carbide (SiC) FET. Robust and transient proof due to LC2 driver technology. Approx. 90% less on-resistance and approx. 30% less natural capacitance compared to switches with classical MOSFET. Free-wheeling diodes may be dispensable in many applications due to the extremely fast instrinsic diodes of the SiC FET. For high capacitive, resistive & inductive load. Please scroll down for the options.
Switch Model
[sorted by voltage]		 Description / Comment
● Preferred stock type  ○ Limited stock  X Not for new development

Voltage
[kV]

Pk.  Current
[A]

On-Resist.
[Ω]

On-Time
[ns]

 Dimensions
L x W x H
[mm3]		 Drawing
(PDF)
HTS 81-15-SiC-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 8 2 x 150 2 x 0.32 100…∞ 150 x 100 x 58 request
HTS 81-30-SiC-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 8 2 x 300 2 x 0.16 100…∞ 150 x 150 x 58 request
HTS 121-15-SiC-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 12 2 x 150 2 x 0.48 120…∞ 200 x 100 x 68 request
HTS 121-30-SiC-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 12 2 x 300 2 x 0.24 120…∞ 200 x 150 x 68 request
HTS 151-15-SiC-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 15 2 x 150 2 x 0.6 150…∞ 200 x 100 x 68 request
HTS 151-30-SiC-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 15 2 x 300 2 x 0.3 150…∞ 200 x 150 x 68 request
HTS 201-15-SiC-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 20 2 x 150 2 x 0.8 150…∞ 225 x 100 x 68 request
HTS 201-30-SiC-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 20 2 x 300 2 x 0.4 150…∞ 225 x 150 x 68 request
HTS 241-15-SiC-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 24 2 x 150 2 x 1 150…∞ 250 x 100 x 68 request
HTS 241-30-SiC-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 24 2 x 300 2 x 0.5 150…∞ 250 x 150 x 68 request
HTS 301-15-SiC-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 30 2 x 150 2 x 1.2 180…∞ 300 x 100 x 68 request
HTS 301-30-SiC-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 30 2 x 300 2 x 0.6 180…∞ 300 x 150 x 68 request
HTS 401-15-SiC-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 40 2 x 150 2 x 1.6 180…∞ 372 x 100 x 70 request
HTS 401-30-SiC-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 40 2 x 300 2 x 0.8 180…∞ 372 x 150 x 70 request
HTS 501-15-SiC-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 50 2 x 150 2 x 2 200…∞ 432 x 100 x 70 request
HTS 501-30-SiC-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 50 2 x 300 2 x 1 200…∞ 432 x 150 x 70 request
HTS 651-15-SiC-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 65 2 x 150 2 x 2.6 200…∞ 372 x 300 x 70 request
HTS 651-30-SiC-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 65 2 x 300 2 x 1.3 200…∞ 372 x 350 x 70 request
HTS 701-15-SiC-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 70 2 x 150 2 x 2.8 220…∞ 375 x 300 x 70 request
HTS 701-30-SiC-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 70 2 x 300 2 x 1.4 220…∞ 375 x 350 x 70 request
HTS 901-15-SiC-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 90 2 x 150 2 x 3.6 220...∞ 432 x 300 x 70 request
HTS 901-30-SiC-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 90 2 x 300 2 x 1.8 220...∞ 432 x 350 x 70 request
HTS 1201-15-SiC-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 120 2 x 150 2 x 4.8 250...∞ 512 x 350 x 70 request
HTS 1201-30-SiC-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 120 2 x 300 2 x 2.4 250...∞ 512 x 350 x 70 request
HTS 1401-15-SiC-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 140 2 x 150 2 x 5.6 250…∞ 672 x 350 x 90 request
HTS 1401-30-SiC-GSM ● Plastic flange housing. Robust LC2 technology. Optionally up to 200 kV isolation. 2 x 140 2 x 300 2 x 2.8 250…∞ 672 x 350 x 90 request
 

Options (1)
B-CON Beginner's Configuration: The standard switch is equipped with various options to simplify first time experiments for users, which are inexperienced with high voltage and high frequency circuit design. The beginner's configuration includes option FH and PT-HV for easy wiring and attachment without printed circuit boards, as well as option LS-C, LP and S-TT for an uncritical EMC behavior. Inexperienced users should also consider the combination with option I-PC or PC to avoid possible difficulties from the high voltage wiring and / or high frequency noise behavior.  (2)     

HFB

High Frequency Burst: Improved burst capability of driver by means of external buffer capacitors. Recommended if more than 10 pulses with less than 10 μs spacing are generated.

HFS

High Frequency Switching: External supply of auxiliary driver voltage (50-350 VDC according to type). Necessary if the specified “Maximum Operating Frequency” shall be exceeded. (2)

LP

Low Pass: Low pass filter at the control input. Propagation delay time will be increased by ~50 ns. Jitter + 500 ps.  Improved noise immunity and  less critical wiring in high speed applications. (3)

S-TT

Soft Transition Time: ”Turn-On Rise Time” & “Turn-Off Rise Time” increased by ~20%. Simplified EMC design and less critical wiring if the shortest possible edge steepness is not required. (3)

LNC

Low Natural Capacitance: CN reduced by approximately 30%. To minimize capacitive power losses in applications with high switching frequency and high switching voltage (Pc= V2 x C x f).

LL

Low Leakage Current: Off-state current reduced to less than 10%  of the specified value. Not available in connection with the cooling fin options and for switches of the UF series.

LN

Low Noise:  Internal power driver modified for zero noise emission for a specific period of time. Relevant in conjunction with sensitive detector amplifiers (e.g. SEV/MCP applications) only. (2)
ALL-OFF Voltage free pulse output in case of fault or if inhibit is "L". Suggested in circuits with positive and negative supply. A pull down-resistor may be required to keep the opened switches potential-free.

ISO-25

25 kV Isolation:  Isolation Voltage increased to  25 kVDC. Housing dimensions may change for some models.

ISO-40

40 kV Isolation:  Isolation Voltage increased to  40 kVDC. Housing dimensions may change for some models.  Only in connection with option PT-HV.

ISO-80

80 kV Isolation:  Isolation Voltage increased to  80 kVDC. Housing dimensions may change for some models.  Only in connection with option PT-HV.

ISO-120

120 kV Isolation: Isolation Voltage increased to 120 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV.

ISO-200

200 kV Isolation: Isolation Voltage increased to 200 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV.

I-PC

Integrated Part Components: Integration of small part components according to customer’s specifications (e.g. buffer capacitors, snubbers, damping resistors, diodes, opto couplers). (2)

PCC

Pulser Configuration. Switch combined with custom specific part components. Integrated in a flange housing with hv connectors according to the customers specifications. (2)

I-FWD

Integrated Free-Wheeling Diode:  Built-in parallel diode with short recovery time. In connection with inductive load only.

I-FWDN

Integrated Free-Wheeling Diode Network:Integrated Free-Wheeling Diode Network: Built-in parallel diode plus serial blocking diode  with short recovery time. In connection with inductive load only.

LS-C

LEMO socket for Control Connection. Input Z=100Ω. An assembled linkage cable (1m/3ft) with two plugs and one socket is included in supply. For improved noise immunity. (3)

PT-C

Pigtail for Control Connection: Flexible leads (l=75 mm) with AMP-modu plug. Refers to switching modules with pins only. Suggested for modules with options CF & GCF.

PT-HV

Pigtails for HV Connection: Flexible leads with cable lugs. For increased creepage. PT-HV is standard for all types with >25 kV switching voltage. Not for extremely fast circuits.

ST-HV

Screw Terminals for HV Connection: Threaded inserts at the bottom of module for PCB attachment. Operation above 25 kV requires liquid insulation (Galden®/Oil) or potting.

SEP-C

Separated Control Unit: Control unit with LED indicators in a separate housing (dim. 79x38x17 mm). Linkage cable (<1m) with plug. Control unit with soldering pins or pigtails.
FOI-I Fibre Optics Input / Inhibit: Additional optical inhibit input to turn-off the switch by using the inhibit input with a fibre-optical signal (only in combination with option SEP-C) (2)
FOI-C Fibre Optics Input / Control: Additional optical control input to trigger the switch with a fibre-optical signal (only in combination with option SEP-C) (2)
FOO-F Fibre Optical Output / Fault: Additional optical output to read-out the failure condition with a fibre-optical signal (only in combination with option SEP-C) (2)

UL94

Flame Retardant Casting Resin:Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2)
FH Flange Housing: Plastic flange housing for isolated attachment on conductive surfaces. Ideal if the switch is not intended for printed circuit boards. Option PT-HV is suggested.

TH

Tubular Housing:Tubular Housing: Tubular instead of rectangular housing. Adaption to specific ambient conditions or in case  of difficult assembly situations. (2)

FC

Flat Case: Height of standard plastic housings reduced to 19 mm or less. Not in combination with cooling options CF, GCF and DLC.

ITC

Increased Thermal Conductivity: Special moulding process to increase the thermal conductivity of the module. Pd(max) will be increased by approx. 20-30%. (2)

CF

Copper Cooling Fins d = 0.5 mm: Fin height 35 mm. Nickel plated. For air cooling with forced or natural convection as well as for liquid cooling with non-conductive coolants.

CF-1

Copper Cooling Fins d = 1 mm: Fin thickness 1.0 mm instead of 0.5 mm. The Max. Power Dissipation Pd(max) will be increased by ~80 %. For air or liquid cooling (e.g. Galden® or oil).

CF-X2

Copper Cooling Fins "XL": Fin area enlarged by factor 2. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling.

CF-X3

Copper Cooling Fins "XXL": Fin area enlarged by factor 3. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling.

CF-CS

Copper Cooling Fins with customized shape: Individual shape to meet specific OEM requirements. (2) Can be combined with options CF-1, CF-D and CF-S for increased cooling power.

CF-LC

Copper Cooling Fins for liquid cooling: Double fins, nickel plated copper, height 20 mm. For the immersion in oil tanks etc. Forced convection recommended. Combinable with opt. CF-S.
CF-D

Double Copper Cooling Fins: Approx. 100% more cooling power, approx. 2mm spacing between fins, forced convection recommended. Combinable with opt. CF-S, CF-X2, CF-X3 and CF-CS.

CF-S

Copper Cooling Fins: Semiconductors soldered on fins. Approx. 30% to 100% more cooling power (type depending). Combinable with options CF-D, CF-X2, CF-X3 and CF-CS.

CF-GRA

Non-isolated Cooling Fins made of graphite: Very light weight compared to copper at similar heat transfer, but reduced heat capacity. 0.5 or 1 mm thickness, height 35 mm.

CF-CER

Isolated Cooling Fins made of ceramics: Heat transfer properties similar to alumina. Forced convection recommended due to 2 mm spacing between fins. Height 35 mm.

CCS

Ceramic Cooling Surface: Top side of switching module made of ceramics. Heat transfer properties similar to alumina. Max. 20 kVDC isolation. Forced convection recommended.

CCF

Ceramic Cooling Flange: Bottom side of switching module made of a plano grinded ceramic plate. Integrated metal frame for uniform and safe contact pressure. Max. 40 kVDC isolation.

C-DR

Cooling for Driver:Cooling for Driver: Extra cooling for the driver and control electronics. Recommended in combination with option HFS at higher switching frequencies. (2)

GCF

Grounded Cooling Flange:Grounded Cooling Flange: Nickel-plated copper flange for medium power. Max. isolation voltage 40kV. Increased coupling capacitance CC.

GCF-X2

Grounded Cooling Flange, Max. Continuous Power Dissipation increased by x2:  Thermal resistance “Switch to Flange” reduced for twice the power capability. (2)

ILC

Indirect Liquid Cooling:  Liquid cooling for all kind of conductive coolants incl. water. Internal heat exchanger made of ceramics. For medium power dissipation.

DLC

Direct Liquid Cooling: Internal cooling channels arround the power semiconductors. The most efficient cooling for high frequency applications. Non-conductive coolants only.

HI-REL

High Reliability / MIL Versions:High Reliability / MIL Versions:  Available on request. (2)

 

 

(1) New option code:  Data sheets may differ from this coding system (especially older ones) and do not indicate all possible options as per above table. (2) Please consult factory for detailed information.
(3) These options are EMC-relevant and are recommended for industrial power applications,  difficult noise ambients,  prototype experiments with flying leads and for users without special EMC design experience.

 

 

Further information, data sheets and drawings are available on request. All data and specifications subject to change without notice.

 REV 15-JUNE-2017
 

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