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E

Fast Recovery High Voltage Diode Assemblies  

● Free-wheeling diodes for HTS solid-state switches in combination with inductive load ● Soft recovery characteristics ● High peak current capability ● Very low inductance ● Short recovery time

MOSFET switches and free-wheeling diodes: In general the forward voltage of  an intrinsic MOSFET switch diode is lower than the forward voltage of an external fast free-wheeling diode. In order to keep the reverse currents safely away from the intrinsic diodes it is neccessary to connect a so called "Blocking Diode" in series to a MOSFET switch. Therefore we always suggest to use this additional blocking diode when MOSFET switches shall be protectted by fast free-wheeling diodes. The blocking diode must have at least the peak current capability of the switch. The hold-off voltage is uncritical and must only be higher than the forward voltage difference between intrinsic diode and free-wheeling diode. The difference is usually some ten volts, in extreme cases some hundred volts (large MOSFET stacks and extremely high peak currents). Sufficient blocking diodes are available as single part component or as an integrated part component of a BEHLKE FDA diode (integrated blocking diode, option IBD and IBD-C). 

 

Customized high voltage diodes: We manufacture every customized high voltage diode assembly between 200 kV hold-off voltage and 100 kA peak current with any cooling option listed below 

 

Product Code: The model number contains coded information about voltage, current and turn-on behavior.  The first digits stand for the voltage in kV, the last digit before the dash indicates the toplogy (0 = standard wthout blocking diode, 1 = with integrated blocking diode). The digits after the dash indicate the current  in Amperes x10. Special features are coded by the letters after a second dash. Example FDA 60-180:  FDA = Fast Diode Assembly, 6 = 6 kV,  0 = Standard, 180 = 1800 Ampere   

Model [sorted by
dimensions]

Description / Comment
 ● Preferred stock type ○ Limited stock  X Not for new development

Dimensions
 [mm3]

Voltage
 [kV]

Pk. Current
 [A]
FDA 60-180 ● Especially for HTS 61-40, HTS 61-240-SI and 61-160-FI
78 x 76 x 25
6
1800
FDA 60-240 ● Especially for HTS 61-40, HTS 61-240-SI and 61-160-FI
102 x 76 x 25
6
2400
FDA 100-75 ●  
84 x 35 x 30
10
750
FDA 100-150 ●  
84 x 35 x 30
10
1500
FDA 160-75 ●  
84 x 35 x 30
16
750
FDA 160-150 ●  
84 x 35 x 30
16
1500
FDA 200-75 ●  
101 x 35 x 30
20
750
FDA 200-150 ●  
101 x 35 x 30
20
1500
FDA 240-75 ●  
116 x 35 x 30
24
750
FDA 240-150 ●  
116 x 35 x 30
24
1500
FDA 300-75 ●  
141 x 35 x 30
30
750
FDA 300-150 ●  
141 x 35 x 30
30
1500
FDA 320-75 ●  
152 x 35 x 30
32
750
FDA 320-150 ●  
152 x 35 x 30
32
1500
FDA 350-150 ●   205 x 35 x 30 35 1500
FDA 640-75 ●  
300 x 35 x 35
64
750
FDA 640-150 ●  
300 x 53 x 53
64
1500
FDA 800-75 ●  
400 x 35 x 35
80
750
FDA 800-150 ●  
400 x 53 x 53
80
1500
FDA 100-300 ●  
84 x 70 x 35
16
3000
FDA 160-300 ●  
103 x 70 x 35
16
3000
FDA 200-300 ●  
103 x 70 x 35
20
3000
FDA 240-300 ●  
116 x 70 x 35
24
3000
FDA 320-300 ●  
152 x 70 x 35
32
3000
FDA 640-300 ●  
300 x 70 x 35
64
3000
FDA 800-300 ●  
370 x 70 x 35
80
3000
FDA 1500-300 ●  
700 x 70 x 35
150
3000

Options

 

 

IBD

Integrated Blocking Diode. Hold-off voltage >1200 VDC, IBD forward peak current same as FDA forward peak.current.

IBD-C

Integrated Blocking Diode. Customized (e.g.higher peak.currents, Schottky Barrier diodes etc.).

PT-HV

Pigtails for HV Connection: Flexible leads with cable lugs. Not recommended in extremely fast circuits.

UL94

Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2)

ITC

Increased Thermal Conductivity: Special moulding process to increase the thermal conductivity of the module. Pd(max) will be increased by approx. 20-30%.

CF

Copper Cooling Fins d = 0.5 mm: Fin height 35 mm. Nickel plated. For air cooling with forced or natural convection as well as for liquid cooling with non-conductive coolants.

CF-1

Copper Cooling Fins d = 1 mm: Fin thickness 1.0 mm instead of 0.5 mm. The Max. Power Dissipation Pd(max) will be increased by ~80 %. For air or liquid cooling (e.g. Galden® or oil).

CF-X2

Copper Cooling Fins "XL": Fin area enlarged by factor 2. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling.

CF-X3

Copper Cooling Fins "XXL": Fin area enlarged by factor 3. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling.

CF-CS

Copper Cooling Fins with customized shape: Individual shape to meet specific OEM requirements. (2) Can be combined with options CF-1, CF-D and CF-S for increased cooling power.

CF-LC

Copper Cooling Fins for liquid cooling: Double fins, nickel plated copper, height 20 mm. For the immersion in oil tanks etc. Forced convection recommended. Combinable with opt. CF-S.
CF-D

Double Copper Cooling Fins: Approx. 100% more cooling power, approx. 2mm spacing between fins, forced convection recommended. Combinable with opt. CF-S, CF-X2, CF-X3 and CF-CS.

CF-S

Copper Cooling Fins: Semiconductors soldered on fins. Approx. 30% to 100% more cooling power (type depending). Combinable with options CF-D, CF-X2, CF-X3 and CF-CS.

CF-GRA

Non-isolated Cooling Fins made of graphite: Very light weight compared to copper at similar heat transfer, but reduced heat capacity. 0.5 or 1 mm thickness, height 35 mm.

CF-CER

Isolated Cooling Fins made of ceramics: Heat transfer properties similar to alumina. Forced convection recommended due to 2 mm spacing between fins. Height 35 mm.

CCS

Ceramic Cooling Surface: Top side of switching module made of ceramics. Heat transfer properties similar to alumina. Max. 20 kVDC isolation. Forced convection recommended.

CCF

Ceramic Cooling Flange: Bottom side of switching module made of a plano grinded ceramic plate. Integrated metal frame for uniform and safe contact pressure. Max. 40 kVDC isolation.

GCF

Grounded Cooling Flange: Cooling by a grounded base plate made of nickel plated copper. For medium power. Increased coupling capacitance. Isolation voltage up to 50 kVDC.

GCF-X2

Grounded Cooling Flange, Max. Continuous Power Dissipation increased by x2:  Thermal resistance “Switch to Flange” reduced for twice the power capability.

GCF-W

Water Cooler for Grounded Cooling Flange:  Flat water cooling plate attached to the grounded cooling flange GCF. With water inlet and outlet.

DLC

Direct Liquid Cooling:  Internal liquid channel in direct contact with the power semiconductors. Very compact cooling solution for medium power. Non-conductive liquids only.

HI-REL

High Reliability / MIL Versions:  Available on request.

 

 

Further information, data sheets and drawings are available on request. All data and specifications subject to change without notice.

 REV 05-AUG-2016
 

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