D |
Laboratory pulser & OEM pulser units |
● HV switches in pulser configuration ● Ready for use ● No external components required ● All pulsers optimized for system integration ● Laboratory pulsers are always CE certified |
GHTS Series, pulser for the laboratory use (with CE certification) | |||||||
Model [sorted by |
Description / Comment |
Drawing (PDF) |
Dimensions |
Voltage |
Pk. Current |
HV Pulse Width |
|
GHTS 60 | ● | Very compact. Polarity reversal manually by earthing plug. 15 nF buffer capacitor. | request |
170 x 110 x 45
|
2 x 6
|
2 x 15
|
100…∞
|
GHTS 30 | ● | Very compact. Polarity reversal manually by earthing plug. 15 nF buffer capacitor. | request |
170 x 110 x 45
|
2 x 3
|
2 x 30
|
100…∞
|
GHTS 30 A | ● | Very compact. Polarity reversal manually by earthing plug. 15 nF buffer capacitor. | request |
170 x 110 x 45
|
2 x 3
|
2 x 60
|
100…∞
|
GHTS 100 | ● | Very compact. Polarity reversal manually by earthing plug. 15 nF buffer capacitor. | request |
210 x 110 x 45
|
2 x 10
|
2 x 15
|
100…∞
|
GHTS 60 A | ● | Very compact. Polarity reversal manually by earthing plug. 15 nF buffer capacitor. | request |
210 x 110 x 45
|
2 x 6
|
2 x 30
|
100…∞
|
GHTS 100 A | ● | Very compact. Polarity reversal manually by earthing plug. 15 nF buffer capacitor. | request |
210 x 110 x 45
|
2 x 10
|
2 x 30
|
100…∞
|
GHTS 60 B | ● | Very compact. Polarity reversal manually by earthing plug. 15 nF buffer capacitor. | request |
210 x 110 x 45
|
2 x 6
|
2 x 60
|
100…∞
|
Options for the GHTS series: | |||||||
Option 01 | Protective Series Resistor 200 Ohm. | ||||||
Option 02 | Built-in Miniature Fan | ||||||
Option 03 | Improved thermal conductivity of the internal switching module by means of an internal ceramic cooling surface |
FSWP Series, Fast Square Wave Pulser, for system integration | |||||||
Model [sorted by dimensions] |
Description / Comment |
Drawing (PDF) |
Dimensions [mm3] |
Voltage [kV] |
Pk. Current [A] |
HV Pulse Width |
|
FSWP 51-02 | ● | Fast square wave pulser, max. repetition rate 3 MHz with option DLC. Instruction Manual | 175 x 80 x 45 | 5.4 | 25 | 50 ns…∞ | |
FSWP 71-02 | ● | Fast square wave pulser, max. repetition rate 3 MHz with option DLC. Instruction Manual | request | 175 x 80 x 45 | 7.2 | 20 | 50 ns…∞ |
FSWP 91-01 | ● | Fast square wave pulser, max. repetition rate 3 MHz with option DLC.. Instruction Manual | 175 x 80 x 45 | 9 | 15 | 50 ns…∞ |
Options for the FSWP Series |
|
ALL-OFF | Voltage free pulse output in case of fault or if inhibit is "L". Suggested in circuits with positive and negative supply. A pull down-resistor may be required to keep the opened switches potential-free. |
FL-IN | Floating High Voltage Inputs, for positive and negative high voltage supply |
I-PC |
Integrated Part Components: Integration of small part components according to customer’s specifications (e.g. buffer capacitors, snubbers, resistors, diodes, opto couplers). (2) |
UL94 |
Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2) |
CF-LC |
Copper Cooling Fins for liquid cooling: Double fins, nickel plated copper, height 20 mm. For the immersion in oil tanks etc. Forced convection recommended. Combinable with opt. CF-S. |
CCF |
Ceramic Cooling Flange: Bottom side of switching module made of a plano grinded ceramic plate. Integrated metal frame for uniform and safe contact pressure. Max. 40 kVDC isolation. |
C-DR |
Cooling for Driver: Extra cooling for the driver and control electronics. Recommended in combination with option HFS at higher switching frequencies. (2) |
ILC |
Indirect Liquid Cooling: Liquid cooling for all kind of conductive coolants incl. water. Internal heat exchanger made of ceramics. For medium power dissipation. |
DLC |
Direct Liquid Cooling: Internal cooling channels arround the power semiconductors. The most efficient cooling for high frequency applications. Non-conductive coolants only. |
FQD Series, Fast Q-Switch Pockels Cell Driver, for system integration | |||||||
Model [sorted by |
Description / Comment |
Drawing (PDF) |
Dimensions |
Voltage |
Pk. Current |
HV Pulse Width Depends on R x C |
|
FQD-30-04-C | ● | Compact Series. Plastic flange housing with pigtails. Cooling options partly not applicable. | 64 x 30 x 18 | 3 | 40 | 100 ns…1 ms | |
FQD-40-02-C | ● | Compact Series. Plastic flange housing with pigtails. Cooling options partly not applicable. | 64 x 30 x 18 | 4 | 20 | 100 ns…1 ms | |
FQD-40-03-C | ● | Compact Series. Plastic flange housing with pigtails. Cooling options partly not applicable. | 64 x 30 x 18 | 4 | 30 | 100 ns…1 ms | |
FQD-50-02-C | ● | Compact Series. Plastic flange housing with pigtails. Cooling options partly not applicable. | 64 x 30 x 18 | 5 | 20 | 100 ns…1 ms | |
FQD-60-03-C | ● | Compact Series. Plastic flange housing with pigtails. Cooling options partly not applicable. | 64 x 30 x 18 | 6 | 30 | 100 ns…1 ms | |
FQD-80-02-C | ● | Compact Series. Plastic flange housing with pigtails. Cooling options partly not applicable. | 64 x 30 x 18 | 8 | 25 | 100 ns…1 ms | |
FQD 40-03 | ● | Based on HTS 40-03, with 200 mm long pigtails for direct pockels cell connection | request |
79 x 38 x 19
|
4
|
35
|
100 ns…1 ms
|
FQD 40-06 | ● | Based on HTS 40-06, with 200 mm long pigtails for direct pockels cell connection | request |
79 x 38 x 19
|
4
|
60
|
100 ns…1 ms
|
FQD 50-02 | ● | Based on HTS 50-02, with 200 mm long pigtails for direct pockels cell connection | request |
79 x 38 x 19
|
5
|
25
|
100 ns…1 ms
|
FQD 50-05 | ● | Based on HTS 50-05, with 200 mm long pigtails for direct pockels cell connection | request |
79 x 38 x 19
|
5
|
50
|
100 ns…1 ms
|
FQD 60-02 | ● | Based on HTS 60-02, with 200 mm long pigtails for direct pockels cell connection | request |
79 x 38 x 19
|
6
|
20
|
100 ns…1 ms
|
FQD 60-04 | ● | Based on HTS 60-04, with 200 mm long pigtails for direct pockels cell connection | request |
79 x 38 x 19
|
6
|
40
|
100 ns…1 ms
|
FQD 80-01 | ● | Based on HTS 80-01, with 200 mm long pigtails for direct pockels cell connection | request |
79 x 38 x 19
|
8
|
15
|
100 ns…1 ms
|
FQD 80-03 | ● | Based on HTS 80-03, with 200 mm long pigtails for direct pockels cell connection | request |
79 x 38 x 19
|
8
|
30
|
100 ns…1 ms
|
FQD 30-08-UF | ● | Based on HTS 30-08-UF, with 200 mm long pigtails for direct pockels cell connection, ultra fast | request |
79 x 38 x 19
|
3
|
80
|
100 ns…1 ms
|
FQD 30-06-UF | ● | Based on HTS 30-06-UF, with 200 mm long pigtails for direct pockels cell connection, ultra fast | request |
79 x 38 x 19
|
3.6
|
60
|
100 ns…1 ms
|
Options for the FQD Series |
|
HFS |
High Frequency Switching: External supply of auxiliary driver voltage. Necessary if the specified “Max. Operating Frequency” shall be exceeded. (2) |
I-PC |
Integrated Part Components: Integration of small part components according to customer’s specifications (e.g. buffer capacitors, snubbers, resistors, diodes, opto couplers). (2) |
PT-C |
Pigtail for Control Connection: Flexible leads (l=75 mm) with PCB connector. This option is only relevant for switching modules with pins. |
PIN-C |
Pins for Control Connection: Gold plated pins for printed circuit board designs (special sockets available). Only relevant for switching modules which have pigtails as standard. |
UL94 |
Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2) |
TH |
Tubular Housing: Tubular instead of rectangular housing. Adaption to specific ambient conditions or in case of difficult assembly situations. (2) |
FC |
Flat Case: Height of standard plastic housings reduced to 19 mm or less. Not in combination with cooling options CF, GCF and DLC. |
ITC |
Increased Thermal Conductivity: Special moulding process to increase the thermal conductivity of the module. Pd(max) will be increased by approx. 20-30%. (2) |
CF |
Copper Cooling Fins d = 0.5 mm: Fin height 35 mm. Nickel plated. For air cooling with forced or natural convection as well as for liquid cooling with non-conductive coolants. |
CF-1 |
Copper Cooling Fins d = 1 mm: Fin thickness 1.0 mm instead of 0.5 mm. The Max. Power Dissipation Pd(max) will be increased by ~80 %. For air or liquid cooling (e.g. Galden® or oil). |
CF-X2 |
Copper Cooling Fins "XL": Fin area enlarged by factor 2. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling. |
CF-X3 |
Copper Cooling Fins "XXL": Fin area enlarged by factor 3. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling. |
CF-CS |
Copper Cooling Fins with customized shape: Individual shape to meet specific OEM requirements. (2) Can be combined with options CF-1, CF-D and CF-S for increased cooling power. |
CF-LC |
Copper Cooling Fins for liquid cooling: Double fins, nickel plated copper, height 20 mm. For the immersion in oil tanks etc. Forced convection recommended. Combinable with opt. CF-S. |
CF-D |
Double Copper Cooling Fins: Approx. 100% more cooling power, approx. 2mm spacing between fins, forced convection recommended. Combinable with opt. CF-S, CF-X2, CF-X3 and CF-CS. |
CF-S |
Copper Cooling Fins: Semiconductors soldered on fins. Approx. 30% to 100% more cooling power (type depending). Combinable with options CF-D, CF-X2, CF-X3 and CF-CS. |
CF-GRA |
Non-isolated Cooling Fins made of graphite: Very light weight compared to copper at similar heat transfer, but reduced heat capacity. 0.5 or 1 mm thickness, height 35 mm. |
CF-CER |
Isolated Cooling Fins made of ceramics: Heat transfer properties similar to alumina. Forced convection recommended due to 2 mm spacing between fins. Height 35 mm. |
CCS |
Ceramic Cooling Surface: Top side of switching module made of ceramics. Heat transfer properties similar to alumina. Max. 20 kVDC isolation. Forced convection recommended. |
CCF |
Ceramic Cooling Flange: Bottom side of switching module made of a plano grinded ceramic plate. Integrated metal frame for uniform and safe contact pressure. Max. 40 kVDC isolation. |
C-DR |
Cooling for Driver: Extra cooling for the driver and control electronics. Recommended in combination with option HFS at higher switching frequencies. (2) |
GCF |
Grounded Cooling Flange: Nickel-plated copper flange for medium power. Max. isolation voltage 40kV. Increased coupling capacitance CC. |
GCF-X2 |
Grounded Cooling Flange, Max. Continuous Power Dissipation increased by x2: Thermal resistance “Switch to Flange” reduced for twice the power capability. (2) |
ILC |
Indirect Liquid Cooling: Liquid cooling for all kind of conductive coolants incl. water. Internal heat exchanger made of ceramics. For medium power dissipation. |
DLC |
Direct Liquid Cooling: Internal cooling channels arround the power semiconductors. The most efficient cooling for high frequency applications. Non-conductive coolants only. |
HI-REL |
High Reliability / MIL Versions: Available on request. (2) |
DSM Series, Differential Switch Mode Pulser, for system integration | |||||||
DSM-Series: Universal pulser for capacitive loads (e.g. pockels cells) in full bridge configuration with ~3 ns to 6 ns electrical transition time and variable pulse width from 4 ns to infinite. The unit consists of two push-pull switches (half-bridge circuits), which are turned on by an internally generated phase-shifted signal, where by phase 1 is given by the leading edge and phase 2 by the trailing edge of the control pulse. The pulse width of the HV pulse across the capacitive load corresponds with the time difference of the shifted signals respectively with the pulse width at the control input. For capacitive load only. Very compact design for placement directly at the pockels cell. Available with cooling options CF, GCF, ILC and DLC for high power operation. |
|||||||
Model [sorted by |
Description / Comment |
Drawing (PDF) |
Dimensions |
Voltage |
Pk. Current |
HV Pulse Width Depends on R x C |
|
DSM 31-03 | ● | LEMO socket for control input with Z=100Ω and SMC input with Z=50Ω. SHV-NIM socket for HV | request | 102 x 76 x 20 |
3
|
30 |
4 ns -
∞
|
DSM 31-02 | ● | LEMO socket for control input with Z=100Ω and SMC input with Z=50Ω. SHV-NIM socket for HV | request | 102 x 76 x 20 |
3.6
|
25 |
5 ns -
∞
|
DSM 61-01 | ● | LEMO socket for control input with Z=100Ω and SMC input with Z=50Ω. SHV-NIM socket for HV | request | 102 x 76 x 20 | 6 | 15 | 5 ns - ∞ |
DSM 91-01 | ● | LEMO socket for control input with Z=100Ω and SMC input with Z=50Ω. SHV-NIM socket for HV | request | 102 x 76 x 20 |
9
|
12 |
10 ns -
∞
|
Options for the DSM Series |
|
HFS |
High Frequency Switching: External supply of auxiliary driver voltage. Necessary if the specified “Max. Operating Frequency” shall be exceeded. (2) |
I-PC |
Integrated Part Components: Integration of small part components according to customer’s specifications (e.g. buffer capacitors, snubbers, resistors, diodes, opto couplers). (2) |
PT-C |
Pigtail for Control Connection: Flexible leads (l=75 mm) with PCB connector. This option is only relevant for switching modules with pins. |
PIN-C |
Pins for Control Connection: Gold plated pins for printed circuit board designs (special sockets available). Only relevant for switching modules which have pigtails as standard. |
UL94 |
Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2) |
TH |
Tubular Housing: Tubular instead of rectangular housing. Adaption to specific ambient conditions or in case of difficult assembly situations. (2) |
FC |
Flat Case: Height of standard plastic housings reduced to 19 mm or less. Not in combination with cooling options CF, GCF and DLC. |
ITC |
Increased Thermal Conductivity: Special moulding process to increase the thermal conductivity of the module. Pd(max) will be increased by approx. 20-30%. (2) |
CF |
Copper Cooling Fins d = 0.5 mm: Fin height 35 mm. Nickel plated. For air cooling with forced or natural convection as well as for liquid cooling with non-conductive coolants. |
CF-1 |
Copper Cooling Fins d = 1 mm: Fin thickness 1.0 mm instead of 0.5 mm. The Max. Power Dissipation Pd(max) will be increased by ~80 %. For air or liquid cooling (e.g. Galden® or oil). |
CF-X2 |
Copper Cooling Fins "XL": Fin area enlarged by factor 2. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling. |
CF-X3 |
Copper Cooling Fins "XXL": Fin area enlarged by factor 3. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling. |
CF-CS |
Copper Cooling Fins with customized shape: Individual shape to meet specific OEM requirements. (2) Can be combined with options CF-1, CF-D and CF-S for increased cooling power. |
CF-LC |
Copper Cooling Fins for liquid cooling: Double fins, nickel plated copper, height 20 mm. For the immersion in oil tanks etc. Forced convection recommended. Combinable with opt. CF-S. |
CF-D |
Double Copper Cooling Fins: Approx. 100% more cooling power, approx. 2mm spacing between fins, forced convection recommended. Combinable with opt. CF-S, CF-X2, CF-X3 and CF-CS. |
CF-S |
Copper Cooling Fins: Semiconductors soldered on fins. Approx. 30% to 100% more cooling power (type depending). Combinable with options CF-D, CF-X2, CF-X3 and CF-CS. |
CF-GRA |
Non-isolated Cooling Fins made of graphite: Very light weight compared to copper at similar heat transfer, but reduced heat capacity. 0.5 or 1 mm thickness, height 35 mm. |
CF-CER |
Isolated Cooling Fins made of ceramics: Heat transfer properties similar to alumina. Forced convection recommended due to 2 mm spacing between fins. Height 35 mm. |
CCS |
Ceramic Cooling Surface: Top side of switching module made of ceramics. Heat transfer properties similar to alumina. Max. 20 kVDC isolation. Forced convection recommended. |
CCF |
Ceramic Cooling Flange: Bottom side of switching module made of a plano grinded ceramic plate. Integrated metal frame for uniform and safe contact pressure. Max. 40 kVDC isolation. |
C-DR |
Cooling for Driver: Extra cooling for the driver and control electronics. Recommended in combination with option HFS at higher switching frequencies. (2) |
GCF |
Grounded Cooling Flange: Nickel-plated copper flange for medium power. Max. isolation voltage 40kV. Increased coupling capacitance CC. |
GCF-X2 |
Grounded Cooling Flange, Max. Continuous Power Dissipation increased by x2: Thermal resistance “Switch to Flange” reduced for twice the power capability. (2) |
ILC |
Indirect Liquid Cooling: Liquid cooling for all kind of conductive coolants incl. water. Internal heat exchanger made of ceramics. For medium power dissipation. |
DLC |
Direct Liquid Cooling: Internal cooling channels arround the power semiconductors. The most efficient cooling for high frequency applications. Non-conductive coolants only. |
HI-REL |
High Reliability / MIL Versions: Available on request. (2) |
FHPP Series, Fast High-Voltage Precision Pulser (with CE certification) |
Model [sorted by dimensions] |
Description / Comment |
Drawing (PDF) |
Dimensions |
Voltage |
Pk. Current |
HV Pulse Width |
|
FHPP 60 | ● | Polarity reversal by internal relays via TTL signal. Built in 100 nF buffer capacitor. | request | 184 x 105 x 92 | 2 x 6 | 2 x 80 | 60…∞ |
FHPP 80 | ● | Polarity reversal by internal relays via TTL signal. Built in 100 nF buffer capacitor. | request | 184 x 105 x 92 | 2 x 8 | 2 x 60 | 60…∞ |
FHPP 100 | ● | Polarity reversal by internal relays via TTL signal. Built in 100 nF buffer capacitor. | request | 184 x 105 x 92 | 2 x 10 | 2 x 50 | 60…∞ |
FHPP 120 | ● | Polarity reversal by internal relays via TTL signal. Built in 100 nF buffer capacitor. | request | 184 x 105 x 92 | 2 x 12 | 2 x 30 | 60…∞ |
|
|
(1) New option code: Data
sheets may differ from this coding system (especially older ones) and
do not indicate all possible options as per above table. (2) Please
consult factory for detailed information. |
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